One-Stop PCB Factory: Prototype to Mass Production
For hardware startups and OEMs, getting high-quality PCBs quickly and reliably is critical. MC PCB is a one-stop contract PCB manufacturer supporting prototypes to volume builds—backed by experienced engineering support and rigorous QA.
MC PCB Co., Ltd.
Began in 2005
One-Stop PCB Factory: Prototype to Mass Production
For hardware startups and OEMs, getting high-quality PCBs quickly and reliably is critical. MC PCB is a one-stop contract PCB manufacturer supporting prototypes to volume builds—backed by experienced engineering support and rigorous QA.
MC PCB Co., Ltd.
Began in 2005
No. 2, Lane 11, Wenming Road, Fourth Industrial Zone, Nanzha, Humen Town, Dongguan City
Custom PCB Fabrication with Speed, Reliability & Audit‑Ready Quality
Bringing a new electronic product to market means tight timelines and exacting specifications. We deliver turnkey PCB production—from quick‑turn prototypes to scalable volumes—so startups and OEMs can focus on innovation while we manage manufacturing complexity and compliance.
MC PCB.,Ltd provides rigid PCB fabrication for prototypes and high-mix production: single-sided to 24-layer FR-4, RF/high-frequency and aluminum boards, plus HDI microvias and heavy copper. UL and ISO 9001/14001/13485 IATF 16949 certified. Quick quotes and fast builds with engineering support. 24/7.
Build rigid-flex PCBs from 1 to 32 layers with 12×18 in panels, 0.0071 in drills, 0.006 in finished holes, 3 oz copper, 3.5 mil trace/space, 5% impedance tolerance and filled blind/buried vias for high-density, reliable designs. Tight mask reg ±0.002 in. Plus 2 seq lams. More.
PCB Attributes (Part 1)
PCB attributes
Flex
Rigid-flex
Min Layer Count
1
1
Max Layer Count
12
≤ 32
Min Core thickness
.001″ (.025 mm)
3 oz (89 ml)
Max Finished Copper Weight (I/L)
2 oz (59 ml)
3 oz (89 ml)
Max Finished Copper thickness (O/L)
12 micron (.012 mm)
9 micron (.009 mm) (only for O/L)
Max Panel Size
12×18
12×18
Smallest Mechanical Drill Diameter
.0079″ (.201 mm)
.0071″ (.180 mm)
Smallest Laser Drill Diameter
No
.005″ (.127 mm)
Min Finished Hole Size
.006″ (.152 mm)
.006″ (.152 mm)
Max through Hole Aspect Ratio
10:01
10:01
Max Blind Via Aspect Ratio
.75:1
.75:1
Min Trace and Space
≥ .0035”(.089 mm)
≥ .0035”(.089 mm)(rigid)
Min Pad Size for Test
.016″ (.406 mm)
.005” (.127 mm) (rigid)
PCB Attributes (Part 2)
PCB attributes
Flex
Rigid-flex
Process Pad Diameter
D + .014″ (.356 mm) (1-mil (.025 mm) annular ring)
D + .014″ (.356 mm) (1-mil (.025 mm) annular ring)
Stacked Vias
No
No
Min Wire Bond Pad Size
> .006″ (.152 mm)
> .006″ (.152 mm)
Controlled Impedance Tolerance
10%
5%
Solder Mask Registration
Within .002″ (.051 mm)
Within .002″ (.051 mm)
Solder Mask Feature Tolerance
.001″ (.025 mm)
.001″ (.025 mm)
Solder Mask Min Dam Size
.004″ (.102 mm)
.001″ (.025 mm)
Min Diameter Route Cutter Available
.019″ (.483 mm)
.024″ (.610 mm)
Mechanical Routed Part Size Tolerance
.003″ (.076 mm)
.010″ (.254 mm)
Bow and Twist Tolerance
N/A
As per spec
Thickness Tolerance
+/- .002″ (.051 mm)
10%
Sequential Laminations
N/A
2
Buried Vias
Yes
Yes
Blind Vias
Yes
Yes
Conductive Filled Vias
No
Yes
Non Conductive Filled Vias
No
Yes
Up to 32 layers (24 standard), FR-4 TG170 or Rogers 4350/370HR, 400×500mm max, 2oz copper, 15:1 PTH aspect, 0.15–0.2mm laser vias, 2/2mil lines, 3mil mask bridges, and HASL/ENIG/OSP/immersion finishes.
Standard and advanced HDI options up to 6 layers, sizes to 1000×500mm, 4–7kW thermal conductivity, 5–6mm thickness, 4oz outer/2oz inner copper, 12:1 aspect ratio, OSP/ENIG, and 0.8mm minimum holes.
Capability Table
Parameter
Standard
Advanced HDI
Layer Count
4
6
Max PCB Delivery Size
400mm*500mm
1000mm*500mm
Thermal Conductivity
4kw
7kw
Board Thickness
5mm
6mm
Outer Based Cu
3OZ
4OZ
Inner Based Cu
1OZ
2OZ
Aspect Ratio
10:01
12:01
Surface Treatment
OSP/ENIG
Min Hole Sizes
1.0mm
0.8mm
Assembly Capability (Part 2)
Capability
Details
Max PCB size
14.5 in. x 19.5 in.
Min PCB Thickness
0.02
Fiducial Marks
Preferred but not required
PCB Finish
SMOBC/HASL
Electrolytic gold
Electroless gold
Electroless silver
Immersion gold
Immersion tin
OSP
PCB Shape
Any
Panelized PCB
Tab routed
Breakaway tabs
V-Scored
Routed + V scored
Inspection
X-ray analysis
Microscope to 20X
Rework
BGA removal and replacement station
SMT IR rework station
Thru-hole rework station
SMT Capability
Double-sided SMT/PTH with BGA both sides, 0201 chips, 0.2mm micro-BGA/lead pitch (1000+ balls), 14.5×19.5in boards, wave soldering, X-ray/20× inspection, and full BGA/SMT/thru-hole rework support.
Assembly Capability (Part 1)
Capability
Details
Single and double sided SMT/PTH
Yes
Large parts on both sides, BGA on both sides
Yes
Smallest Chips size
0201
Min BGA and Micro BGA pitch and ball counts
0.008 in. (0.2mm) pitch, ball count greater than 1000
Min Leaded parts pitch
0.008 in. (0.2 mm)
Max Parts size assembly by machine
2.2 in. x 2.2 in. x 0.6 in.
Assembly surface mount connectors
Yes
Odd form parts
Yes
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets
Wave soldering
Yes
Industry‑Focused PCB Solutions
Manufacturing approaches tailored to reliability, compliance, and lifecycle expectations across key industries.
Automotive Electronics
Traceability and reliability practices aligned to automotive supply chain expectations.
Tell us what you need. We typically reply within 24 hours.
MC PCB.,Ltd, alongside Dongguan MaoChang Printed Circuit Board Limited,has focused on PCB manufacturing over 20 years. MaoChang Printed Circuit Board Limited, a professional PCB factory for Quick Turn PCB, Prototype PCB and High Mix Low Volume fabrication. With UL certification for Rigid FR-4 / High Frequency / Aluminum Based PCB production.
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Contact
0755-2889 4567
Room 1803, lA Building, Longwan, Nanhuai Road, Shajing, Bao'an District,Shenzhen City
No. 2, Lane 11, Wenming Road, Fourth Industrial Zone, Nanzha, Humen Town, Dongguan City