{"id":1123,"date":"2026-01-19T07:02:39","date_gmt":"2026-01-19T07:02:39","guid":{"rendered":"https:\/\/template01.zehannet.net\/?p=1123"},"modified":"2026-01-19T07:02:40","modified_gmt":"2026-01-19T07:02:40","slug":"which-surface-finish-is-best-for-fine-pitch-bga-components","status":"publish","type":"post","link":"https:\/\/template01.zehannet.net\/ar\/which-surface-finish-is-best-for-fine-pitch-bga-components\/","title":{"rendered":"Which surface finish is best for fine-pitch BGA components?"},"content":{"rendered":"<div class=\"wp-block-rank-math-toc-block\" id=\"rank-math-toc\"><h2>Table of Contents<\/h2><nav><ul><li><a href=\"#fine-pitch-bga-surface-finish-what-really-matters\">Fine-pitch BGA surface finish: what really matters<\/a><\/li><li><a href=\"#planarity-for-fine-pitch-bga\">Planarity for fine-pitch BGA<\/a><\/li><li><a href=\"#enig-for-fine-pitch-bga\">ENIG for fine-pitch BGA<\/a><ul><li><a href=\"#black-pad-risk-in-enig\">Black pad risk in ENIG<\/a><\/li><li><a href=\"#when-enig-makes-the-most-sense\">When ENIG makes the most sense<\/a><\/li><\/ul><\/li><li><a href=\"#enepig-for-fine-pitch-bga\">ENEPIG for fine-pitch BGA<\/a><ul><li><a href=\"#when-enepig-is-worth-the-extra-cost\">When ENEPIG is worth the extra cost<\/a><\/li><\/ul><\/li><li><a href=\"#immersion-silver-for-fine-pitch-bga\">Immersion Silver for fine-pitch BGA<\/a><ul><li><a href=\"#where-immersion-silver-fits-well\">Where immersion silver fits well<\/a><\/li><\/ul><\/li><li><a href=\"#immersion-tin-for-fine-pitch-bga\">Immersion Tin for fine-pitch BGA<\/a><\/li><li><a href=\"#osp-for-fine-pitch-bga\">OSP for fine-pitch BGA<\/a><ul><li><a href=\"#multiple-reflow-cycles-and-osp\">Multiple reflow cycles and OSP<\/a><\/li><\/ul><\/li><li><a href=\"#lead-free-hasl-and-fine-pitch-limits\">Lead-free HASL and fine-pitch limits<\/a><\/li><li><a href=\"#surface-finish-comparison-table-for-fine-pitch-bga\">Surface finish comparison table for fine-pitch BGA<\/a><\/li><li><a href=\"#quick-selection-checklist-for-oem-and-ems\">Quick selection checklist for OEM and EMS<\/a><\/li><\/ul><\/nav><\/div>\n\n\n\n<p>If you\u2019re building a fine-pitch BGA board, you don\u2019t need \u201cfancier.\u201d You need&nbsp;<strong>flat, clean, and predictable<\/strong>. Fine pitch doesn\u2019t forgive wobble in the finish, oxidation on pads, or a tight solderability window. One bad choice can turn your first SMT run into a rework loop with X-ray queues, head-in-pillow suspects, and yield hits.<\/p>\n\n\n\n<p>This is exactly why a&nbsp;<strong>China PCB B2B factory: fast prototyping, reliable assembly<\/strong>&nbsp;like ours keeps the surface-finish discussion tied to real production outcomes, not brochure talk. Start at the homepage if you want the full picture of how we support quick-turn + volume + OEM\/ODM workflows:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/\">China PCB B2B factory: fast prototyping, reliable assembly<\/a>.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-4.jpg\" alt=\"Which surface finish is best for fine-pitch BGA components\" class=\"wp-image-1126\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-4.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-4-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-4-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-4-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"fine-pitch-bga-surface-finish-what-really-matters\">Fine-pitch BGA surface finish: what really matters<\/h2>\n\n\n\n<p>For fine-pitch BGA, the surface finish choice is basically a fight between three priorities:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Planarity<\/strong>: flatter pads help the solder balls collapse evenly and reduce opens\/bridging.<\/li>\n\n\n\n<li><strong>Pad protection<\/strong>: you want pads that stay solderable after shipping, storage, and handling.<\/li>\n\n\n\n<li><strong>Process stability<\/strong>: the finish has to behave the same across panels, lots, and time.<\/li>\n<\/ul>\n\n\n\n<p>In the real world, the \u201cbest\u201d finish depends on what hurts you most: early NPI risk, long lead-time logistics, multiple reflow passes, or tight cost targets.<\/p>\n\n\n\n<p>If you\u2019re doing&nbsp;<strong>fine-pitch HDI PCB fabrication<\/strong>, the finish decision should sit next to your stackup, microvia plan, and mask strategy. Here\u2019s a relevant internal example:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/b2b-oem-multi-layer-hdi-pcb-fabrication-for-fine-pitch\/\">fine-pitch HDI PCB fabrication<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"planarity-for-fine-pitch-bga\">Planarity for fine-pitch BGA<\/h2>\n\n\n\n<p>Planarity is the quiet dealbreaker. Fine pitch means smaller balls, tighter standoff, and less paste volume margin. A finish that leaves \u201chills and valleys\u201d can push you into:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Uneven wetting<\/strong>\u00a0and inconsistent collapse<\/li>\n\n\n\n<li><strong>Bridging<\/strong>\u00a0between adjacent pads<\/li>\n\n\n\n<li><strong>Random opens<\/strong>\u00a0that only show up under X-ray (and ruin your confidence in the whole run)<\/li>\n<\/ul>\n\n\n\n<p>So the finish conversation is really a planarity conversation first.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-3.jpg\" alt=\"Which surface finish is best for fine-pitch BGA components\" class=\"wp-image-1125\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-3.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-3-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-3-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-3-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"enig-for-fine-pitch-bga\">ENIG for fine-pitch BGA<\/h2>\n\n\n\n<p>ENIG (Electroless Nickel \/ Immersion Gold) stays popular for a reason: it\u2019s&nbsp;<strong>flat<\/strong>&nbsp;and it&nbsp;<strong>protects copper well<\/strong>. For many fine-pitch BGAs\u2014especially when you ship boards across borders or hold inventory\u2014ENIG is the \u201cdefault safe\u201d option.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"black-pad-risk-in-enig\">Black pad risk in ENIG<\/h3>\n\n\n\n<p>ENIG also comes with a manufacturing truth:&nbsp;<strong>the nickel process has to be controlled<\/strong>. If the nickel layer chemistry drifts, you can see the classic \u201cblack pad\u201d failure mode (brittle intermetallic interface, poor wetting, unreliable joints). You don\u2019t fix that in assembly. You prevent it with tight process control and incoming checks.<\/p>\n\n\n\n<p>If you want ENIG without surprises, align it with your supplier\u2019s&nbsp;<strong>quality control<\/strong>&nbsp;plan and inspection flow (AOI + thickness checks + process records). Here\u2019s how we frame it:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/quality\/\">quality control<\/a>.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"when-enig-makes-the-most-sense\">When ENIG makes the most sense<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>0.4\u20130.5 mm pitch BGAs where you want\u00a0<strong>predictable coplanarity<\/strong><\/li>\n\n\n\n<li>Boards that travel or sit before SMT (longer shelf-life expectations)<\/li>\n\n\n\n<li>Mixed-technology builds where flatness helps stencil performance and joint uniformity<\/li>\n<\/ul>\n\n\n\n<p>If you want to see an internal product page that matches the scenario (gold finish pads, multi-layer performance), check:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/oem-high-frequency-6-layer-pcb-with-enig-pads-b2b-supplier\/\">ENIG pads<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"enepig-for-fine-pitch-bga\">ENEPIG for fine-pitch BGA<\/h2>\n\n\n\n<p>ENEPIG adds palladium between nickel and gold. In practice, people choose ENEPIG when they want&nbsp;<strong>more reliability headroom<\/strong>&nbsp;or they need compatibility with specialized assembly flows (for example, certain bonding or mixed finishing constraints).<\/p>\n\n\n\n<p>ENEPIG often costs more and not every supply chain runs it with the same maturity. So it\u2019s not \u201cbetter by default.\u201d It\u2019s better when your product risk profile demands it.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"when-enepig-is-worth-the-extra-cost\">When ENEPIG is worth the extra cost<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High-reliability builds that can\u2019t afford field returns<\/li>\n\n\n\n<li>Programs where your customer\u2019s acceptance process is strict (FAI, audits, traceability)<\/li>\n\n\n\n<li>Builds that routinely face harsh environments or long service life<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-2.jpg\" alt=\"Which surface finish is best for fine-pitch BGA components\" class=\"wp-image-1124\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-2.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-2-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-2-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-2-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"immersion-silver-for-fine-pitch-bga\">Immersion Silver for fine-pitch BGA<\/h2>\n\n\n\n<p>Immersion Silver (ImAg) can be a strong choice for fine pitch because it\u2019s&nbsp;<strong>very flat<\/strong>. It can also be cost-friendly compared with ENIG. The tradeoff is&nbsp;<strong>handling and contamination sensitivity<\/strong>.<\/p>\n\n\n\n<p>If you\u2019ve ever seen \u201clooks fine, solders weird,\u201d silver can be part of that story when storage and packaging aren\u2019t tight. Fingerprints, sulfur exposure, and sloppy packing can narrow your solderability window fast.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"where-immersion-silver-fits-well\">Where immersion silver fits well<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>NPI builds where you need flatness but want to manage cost<\/li>\n\n\n\n<li>Fast-turn programs where boards go straight to SMT, not to a warehouse<\/li>\n\n\n\n<li>Teams that already run strict packaging rules (vacuum pack, desiccant, controlled handling)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"immersion-tin-for-fine-pitch-bga\">Immersion Tin for fine-pitch BGA<\/h2>\n\n\n\n<p>Immersion Tin (ImSn) is also flat, and it can support fine geometry. The catch is that tin tends to demand stricter controls around:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Storage window<\/li>\n\n\n\n<li>Handling<\/li>\n\n\n\n<li>Process compatibility (including concerns like tin whiskers in some contexts)<\/li>\n<\/ul>\n\n\n\n<p>If your program has disciplined logistics and you\u2019re not parking boards for long periods, immersion tin can work. If your program is messy\u2014boards sitting, rework cycles, unplanned delays\u2014it can become a headache.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"osp-for-fine-pitch-bga\">OSP for fine-pitch BGA<\/h2>\n\n\n\n<p>OSP (Organic Solderability Preservative) is&nbsp;<strong>very flat<\/strong>&nbsp;and usually&nbsp;<strong>low cost<\/strong>. It\u2019s great when the board goes from fab to SMT quickly. But OSP can be sensitive to:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Multiple reflow cycles<\/li>\n\n\n\n<li>Aggressive handling or abrasion<\/li>\n\n\n\n<li>Long storage before assembly<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"multiple-reflow-cycles-and-osp\">Multiple reflow cycles and OSP<\/h3>\n\n\n\n<p>Fine-pitch BGA builds often see more than one heat event: primary reflow, selective rework, maybe a second pass for top\/bottom. If you expect multiple reflow or a longer assembly timeline, OSP can tighten your margin.<\/p>\n\n\n\n<p>OSP shines in disciplined, fast-moving production. It\u2019s less forgiving when schedules slip.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"lead-free-hasl-and-fine-pitch-limits\">Lead-free HASL and fine-pitch limits<\/h2>\n\n\n\n<p>Lead-free HASL (Hot Air Solder Leveling) can be rugged and cost-effective, but it\u2019s typically not the first pick for fine-pitch BGA because it\u2019s not the flattest finish. You can run it successfully at larger pitches, but once pitch tightens, HASL can raise bridging risk and variation.<\/p>\n\n\n\n<p>If your design is borderline, HASL can turn into \u201cit works until it doesn\u2019t,\u201d especially across different panel zones.<\/p>\n\n\n\n<p>Here\u2019s an internal HASL example page for context:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/wholesale-fr4-single-sided-pcb-with-hasl-surface-finish\/\">lead-free HASL surface finish<\/a>.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-1.jpg\" alt=\"Which surface finish is best for fine-pitch BGA components\" class=\"wp-image-1127\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-1.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-1-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-1-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/Which-surface-finish-is-best-for-fine-pitch-BGA-components-1-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"surface-finish-comparison-table-for-fine-pitch-bga\">Surface finish comparison table for fine-pitch BGA<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Surface finish<\/th><th>Planarity for fine-pitch BGA<\/th><th>Typical pain points<\/th><th>Best-fit scenarios<\/th><th>\u201cSource\u201d (industry guidance &amp; fab\/SMT practice)<\/th><\/tr><\/thead><tbody><tr><td>ENIG<\/td><td>Very good<\/td><td>Black pad risk if nickel process drifts; higher cost<\/td><td>Fine pitch, longer storage, cross-border logistics, stable yield targets<\/td><td>PCB fab process control + SMT joint reliability notes<\/td><\/tr><tr><td>ENEPIG<\/td><td>Very good<\/td><td>Higher cost; supply maturity varies<\/td><td>High-reliability builds; strict customer acceptance<\/td><td>Reliability-focused finishing guidance<\/td><\/tr><tr><td>Immersion Silver (ImAg)<\/td><td>Excellent<\/td><td>Tarnish\/contamination sensitivity; packaging discipline needed<\/td><td>Quick-turn to SMT; cost-aware fine pitch<\/td><td>Assembly handling + solderability window practice<\/td><\/tr><tr><td>Immersion Tin (ImSn)<\/td><td>Excellent<\/td><td>Storage\/handling sensitivity; whisker concerns in some programs<\/td><td>Controlled logistics; fine geometry<\/td><td>Finish stability + storage-control practice<\/td><\/tr><tr><td>OSP<\/td><td>Excellent<\/td><td>Shorter process window; multiple reflow sensitivity<\/td><td>Very fast fab-to-assembly flow; high-volume cost control<\/td><td>Reflow-cycle and handling sensitivity practice<\/td><\/tr><tr><td>Lead-free HASL<\/td><td>Fair to good (varies)<\/td><td>Less flat; higher bridging risk at tight pitch<\/td><td>Larger pitch BGAs; rugged cost-driven boards<\/td><td>Planarity vs pitch tradeoff practice<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"quick-selection-checklist-for-oem-and-ems\">Quick selection checklist for OEM and EMS<\/h2>\n\n\n\n<p>If you\u2019re an OEM, brand owner, EMS, or design house trying to lock a finish fast, use this as a practical shortcut:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Pitch \u2264 0.5 mm<\/strong>: default to\u00a0<strong>ENIG<\/strong>\u00a0unless your assembly flow strongly favors something else.<\/li>\n\n\n\n<li><strong>High reliability \/ harsh use<\/strong>: consider\u00a0<strong>ENEPIG<\/strong>, especially if field failure cost is brutal.<\/li>\n\n\n\n<li><strong>Cost pressure + fast SMT turnaround<\/strong>:\u00a0<strong>ImAg<\/strong>\u00a0or\u00a0<strong>OSP<\/strong>\u00a0can work if logistics stay tight.<\/li>\n\n\n\n<li><strong>Multiple reflow or unpredictable schedule<\/strong>: lean away from finishes with short windows (often OSP\/ImSn) unless your process is disciplined.<\/li>\n\n\n\n<li><strong>If you\u2019re tempted by HASL<\/strong>: sanity-check pitch, stencil strategy, and yield tolerance first.<\/li>\n<\/ul>\n\n\n\n<p>And don\u2019t treat surface finish as a standalone choice. Tie it to the whole build: pad design, solder mask definition, via-in-pad decisions, stencil aperture, paste type, and reflow profile. That\u2019s how you prevent \u201cmystery defects.\u201d<\/p>\n\n\n\n<p>If you want a single team to cover&nbsp;<strong>PCB fabrication<\/strong>&nbsp;+&nbsp;<strong>PCB assembly<\/strong>&nbsp;under one quality system (so finish decisions match the SMT line reality), start here:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/services\/pcb-fabrication\/\">PCB fabrication<\/a>&nbsp;and&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/services\/pcb-assembly\/\">PCB assembly<\/a>. For HDI and fine geometry, it also helps to align early with capability limits and DFM rules:&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/capabilities\/\">HDI capabilities<\/a>.<\/p>","protected":false},"excerpt":{"rendered":"<p>Pick the right surface finish for fine-pitch BGA: focus on pad flatness, shelf life, and assembly risk. Compare ENIG, ENEPIG, OSP, ImAg, ImSn.<\/p>","protected":false},"author":1,"featured_media":1126,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_gspb_post_css":"","footnotes":""},"categories":[1],"tags":[773,714,772,761,760,599],"class_list":["post-1123","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-market-trends","tag-enepig","tag-enig","tag-fine-pitch-bga","tag-immersion-silver","tag-osp","tag-pcb-assembly"],"blocksy_meta":[],"_links":{"self":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts\/1123","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/comments?post=1123"}],"version-history":[{"count":1,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts\/1123\/revisions"}],"predecessor-version":[{"id":1128,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts\/1123\/revisions\/1128"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/media\/1126"}],"wp:attachment":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/media?parent=1123"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/categories?post=1123"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/tags?post=1123"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}