{"id":1055,"date":"2026-01-19T03:40:39","date_gmt":"2026-01-19T03:40:39","guid":{"rendered":"https:\/\/template01.zehannet.net\/?p=1055"},"modified":"2026-01-19T03:40:40","modified_gmt":"2026-01-19T03:40:40","slug":"how-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards","status":"publish","type":"post","link":"https:\/\/template01.zehannet.net\/ar\/how-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards\/","title":{"rendered":"How do different copper weights affect thermal performance on metal core boards?"},"content":{"rendered":"<div class=\"wp-block-rank-math-toc-block\" id=\"rank-math-toc\"><h2>Table of Contents<\/h2><nav><ul><li><a href=\"#copper-weight-on-mcpcb-and-thermal-performance\">Copper weight on MCPCB and thermal performance<\/a><\/li><li><a href=\"#thermal-conductivity-and-the-mcpcb-thermal-stack-up\">Thermal conductivity and the MCPCB thermal stack-up<\/a><\/li><li><a href=\"#lateral-heat-spreading-vs-vertical-heat-transfer\">Lateral heat spreading vs vertical heat transfer<\/a><ul><li><a href=\"#lateral-heat-spreading-in-copper\">Lateral heat spreading in copper<\/a><\/li><li><a href=\"#vertical-heat-transfer-through-the-dielectric\">Vertical heat transfer through the dielectric<\/a><\/li><\/ul><\/li><li><a href=\"#copper-thickness-oz-vs-thermal-and-electrical-impact\">Copper thickness (oz) vs thermal and electrical impact<\/a><\/li><li><a href=\"#current-carrying-capacity-and-i-r-heating\">Current carrying capacity and I\u00b2R heating<\/a><\/li><li><a href=\"#diminishing-returns-and-when-copper-weight-won-t-save-you\">Diminishing returns and when copper weight won\u2019t save you<\/a><\/li><li><a href=\"#practical-scenarios-for-copper-weight-selection\">Practical scenarios for copper weight selection<\/a><ul><li><a href=\"#led-lighting-and-hot-spot-control\">LED lighting and hot spot control<\/a><\/li><li><a href=\"#automotive-and-industrial-reliability\">Automotive and industrial reliability<\/a><\/li><li><a href=\"#power-modules-and-board-as-a-heatsink-designs\">Power modules and \u201cboard-as-a-heatsink\u201d designs<\/a><\/li><\/ul><\/li><li><a href=\"#dfm-constraints-for-thick-copper-on-mcpcb\">DFM constraints for thick copper on MCPCB<\/a><\/li><li><a href=\"#quick-checklist-for-choosing-copper-weight-on-metal-core-boards\">Quick checklist for choosing copper weight on metal core boards<\/a><\/li><\/ul><\/nav><\/div>\n\n\n\n<p>If you\u2019re using a metal core PCB (MCPCB \/ IMS) for LEDs, power modules, or motor drives, copper weight is one of the first knobs you\u2019ll touch. It looks simple: thicker copper should run cooler, right? Sometimes yes. Sometimes it barely moves the needle because the real bottleneck sits somewhere else in the thermal stack-up.<\/p>\n\n\n\n<p>This guide breaks down what copper weight really changes on metal core boards, when it helps, and when you should focus on other parts of the build. For quick-turn builds and volume OEM\/ODM runs, you\u2019ll also see what to flag for DFM so you don\u2019t get stuck in back-and-forth. You can also check our&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/\">China PCB B2B factory<\/a>&nbsp;for fast prototyping, mass production, and assembly workflows that fit EMS and brand teams.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-2.jpg\" alt=\"How do different copper weights affect thermal performance on metal core boards\" class=\"wp-image-1058\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-2.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-2-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-2-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-2-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"copper-weight-on-mcpcb-and-thermal-performance\">Copper weight on MCPCB and thermal performance<\/h2>\n\n\n\n<p>Copper weight usually means ounces per square foot (oz\/ft\u00b2). In plain terms:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>1 oz<\/strong>\u00a0copper \u2248\u00a0<strong>35 \u03bcm<\/strong><\/li>\n\n\n\n<li><strong>2 oz<\/strong>\u00a0\u2248\u00a0<strong>70 \u03bcm<\/strong><\/li>\n\n\n\n<li><strong>3 oz<\/strong>\u00a0\u2248\u00a0<strong>105 \u03bcm<\/strong><\/li>\n\n\n\n<li><strong>4 oz<\/strong>\u00a0\u2248\u00a0<strong>140 \u03bcm<\/strong><\/li>\n<\/ul>\n\n\n\n<p>On an MCPCB, copper weight affects&nbsp;<strong>heat spreading in the copper layer<\/strong>&nbsp;and&nbsp;<strong>electrical loss (I\u00b2R)<\/strong>. But it doesn\u2019t automatically fix&nbsp;<strong>through-thickness heat flow<\/strong>&nbsp;into the metal base.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"thermal-conductivity-and-the-mcpcb-thermal-stack-up\">Thermal conductivity and the MCPCB thermal stack-up<\/h2>\n\n\n\n<p>An MCPCB is basically a thermal sandwich:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Copper circuit layer<\/strong>\u00a0(where heat spreads sideways)<\/li>\n\n\n\n<li><strong>Dielectric layer<\/strong>\u00a0(electrical isolation + heat transfer downward)<\/li>\n\n\n\n<li><strong>Metal base<\/strong>\u00a0(aluminum or copper core that spreads heat into the chassis\/heatsink)<\/li>\n<\/ol>\n\n\n\n<p>Here\u2019s the key reality: the&nbsp;<strong>dielectric layer often dominates thermal resistance<\/strong>. If that dielectric has modest thermal conductivity or it\u2019s too thick, you can stack on more copper and still watch your junction temperature stay stubbornly high.<\/p>\n\n\n\n<p>So think of copper weight as a&nbsp;<strong>spreader upgrade<\/strong>, not a magic \u201cheat-to-heatsink\u201d shortcut.<\/p>\n\n\n\n<p>If your project needs an IMS\/MCPCB build, start from the material and process side first\u2014our&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/capabilities\/\">Capabilities<\/a>&nbsp;page gives a quick overview of what can be controlled in the stack-up, and our&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/quality\/\">Quality<\/a>&nbsp;flow shows how we keep consistency from prototype to batch.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-1.jpg\" alt=\"How do different copper weights affect thermal performance on metal core boards\" class=\"wp-image-1057\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-1.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-1-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-1-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-1-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"lateral-heat-spreading-vs-vertical-heat-transfer\">Lateral heat spreading vs vertical heat transfer<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"lateral-heat-spreading-in-copper\">Lateral heat spreading in copper<\/h3>\n\n\n\n<p>Thicker copper gives you more cross-sectional area, which helps heat move&nbsp;<strong>sideways<\/strong>&nbsp;away from a hot spot. That matters when you have:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>High power density LEDs (tight emitter pitch)<\/li>\n\n\n\n<li>MOSFETs\/diodes with small pads dumping a lot of heat<\/li>\n\n\n\n<li>Localized hot components near plastics, lenses, or touch surfaces<\/li>\n<\/ul>\n\n\n\n<p>More copper weight can lower peak temperature by smoothing the gradient. You\u2019ll often \u201cfeel\u201d this improvement in thermal camera images: the hot spot spreads out, and the peak drops.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"vertical-heat-transfer-through-the-dielectric\">Vertical heat transfer through the dielectric<\/h3>\n\n\n\n<p>Heat still has to go&nbsp;<strong>down<\/strong>&nbsp;through the dielectric into the metal core. If the dielectric is the choke point, copper weight helps less than you expect.<\/p>\n\n\n\n<p>A good rule of thumb:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>If the board shows a tight hot spot right at the device and the core stays relatively cool, your dielectric path is likely limiting you.<\/li>\n\n\n\n<li>If the whole copper area warms up evenly but the peak is still high, you may need both better dielectric and better interface to the heatsink.<\/li>\n<\/ul>\n\n\n\n<p>For MCPCB builds used in lighting, you can also look at our&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/b2b-oem-aluminum-mcpcb-panel-for-automotive-led-lighting\/\">Aluminum MCPCB panel for automotive LED lighting<\/a>&nbsp;as a practical reference for the kind of product structures buyers typically request.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"960\" height=\"720\" src=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-3.jpg\" alt=\"How do different copper weights affect thermal performance on metal core boards\" class=\"wp-image-1056\" title=\"\" srcset=\"https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-3.jpg 960w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-3-600x450.jpg 600w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-3-300x225.jpg 300w, https:\/\/template01.zehannet.net\/wp-content\/uploads\/2026\/01\/How-do-different-copper-weights-affect-thermal-performance-on-metal-core-boards-3-768x576.jpg 768w\" sizes=\"auto, (max-width: 960px) 100vw, 960px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"copper-thickness-oz-vs-thermal-and-electrical-impact\">Copper thickness (oz) vs thermal and electrical impact<\/h2>\n\n\n\n<p>Here\u2019s a practical table you can drop into a spec review. It focuses on what engineers actually care about: spreading, I\u00b2R loss, and what manufacturing will push back on.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Copper weight<\/th><th class=\"has-text-align-right\" data-align=\"right\">Approx. thickness<\/th><th>What it does for thermal performance<\/th><th>What it changes electrically<\/th><th>DFM \/ production notes<\/th><\/tr><\/thead><tbody><tr><td>1 oz<\/td><td class=\"has-text-align-right\" data-align=\"right\">~35 \u03bcm<\/td><td>Baseline heat spreading; OK when hot spots aren\u2019t extreme<\/td><td>Standard resistance and current density<\/td><td>Easiest etching window; best for finer features<\/td><\/tr><tr><td>2 oz<\/td><td class=\"has-text-align-right\" data-align=\"right\">~70 \u03bcm<\/td><td>Noticeably better lateral spreading; helps flatten hot spots<\/td><td>Lower trace resistance; less I\u00b2R heating<\/td><td>Feature control tighter; watch solder mask dams and pad definition<\/td><\/tr><tr><td>3 oz<\/td><td class=\"has-text-align-right\" data-align=\"right\">~105 \u03bcm<\/td><td>Stronger spreading for power zones; useful for concentrated loads<\/td><td>Further lowers resistance; better margin on power rails<\/td><td>DFM gets stricter; small geometry may need redesign or wider rules<\/td><\/tr><tr><td>4 oz<\/td><td class=\"has-text-align-right\" data-align=\"right\">~140 \u03bcm<\/td><td>Best for heavy heat spreading in copper layer; diminishing returns if dielectric is limiting<\/td><td>High current handling potential; robust planes<\/td><td>More process attention; plan for larger clearances and stable plating\/etch control<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>If you\u2019re mixing fine-pitch control logic and a beefy power stage, consider splitting the design into clear zones and telling your fab house what matters most. You can also pair fabrication and assembly in one flow to avoid handoff gaps\u2014see&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/services\/pcb-fabrication\/\">PCB fabrication<\/a>&nbsp;and&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/services\/pcb-assembly\/\">PCB assembly<\/a>&nbsp;options.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"current-carrying-capacity-and-i-r-heating\">Current carrying capacity and I\u00b2R heating<\/h2>\n\n\n\n<p>Copper weight isn\u2019t only about thermal conduction. It also cuts resistive loss, which means the board generates&nbsp;<strong>less heat in the first place<\/strong>.<\/p>\n\n\n\n<p>This shows up in real builds like:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>LED drivers with high DC current paths<\/li>\n\n\n\n<li>Motor control boards where the power stage runs hot under load<\/li>\n\n\n\n<li>Power distribution bars feeding multiple channels<\/li>\n<\/ul>\n\n\n\n<p>If your copper is too thin, the trace becomes a heater. Then you\u2019re fighting heat from two sides: component dissipation&nbsp;<strong>plus<\/strong>&nbsp;copper loss. Thicker copper reduces that self-heating and gives you more derating headroom.<\/p>\n\n\n\n<p>For power-heavy products, you might also want to browse heavy copper options like&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/oem-heavy-copper-multilayer-pcb-6oz-thick-copper-supplier\/\">Heavy copper 6oz thick copper<\/a>&nbsp;or metal core variants like&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/heavy-copper-enig-metal-core-pcb-oem-manufacturer-supplier\/\">Heavy copper ENIG metal core PCB<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"diminishing-returns-and-when-copper-weight-won-t-save-you\">Diminishing returns and when copper weight won\u2019t save you<\/h2>\n\n\n\n<p>You\u2019ll hit diminishing returns fast if the \u201creal\u201d limiter is elsewhere. Common traps:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Dielectric too thick \/ too low-k<\/strong>: heat can\u2019t reach the core efficiently.<\/li>\n\n\n\n<li><strong>Poor interface to heatsink<\/strong>: no amount of copper fixes a bad TIM, uneven mounting, or warped contact.<\/li>\n\n\n\n<li><strong>Tiny thermal pad<\/strong>: if the device footprint is small and the design doesn\u2019t spread heat with copper pours, you\u2019re bottlenecked at the pad.<\/li>\n<\/ul>\n\n\n\n<p>In these cases, you often get more by adjusting the&nbsp;<strong>thermal stack-up<\/strong>, the&nbsp;<strong>copper area<\/strong>, and the&nbsp;<strong>mechanical interface<\/strong>&nbsp;than by jumping from 2 oz to 4 oz.<\/p>\n\n\n\n<p>If your product is LED- or module-heavy, it\u2019s also worth looking at an IMS-style build like&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/oem-high-thermal-conductivity-ims-pcb-for-led-power-modules\/\">High thermal conductivity IMS PCB for LED power modules<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"practical-scenarios-for-copper-weight-selection\">Practical scenarios for copper weight selection<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"led-lighting-and-hot-spot-control\">LED lighting and hot spot control<\/h3>\n\n\n\n<p>In LED boards, the pain point is usually&nbsp;<strong>junction temperature<\/strong>&nbsp;and&nbsp;<strong>color shift<\/strong>&nbsp;over time. Thicker copper helps you spread heat away from each emitter, especially when LEDs sit close together. Pair that with a large copper pour under and around the LED pads, and you\u2019ll see a more stable thermal map.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"automotive-and-industrial-reliability\">Automotive and industrial reliability<\/h3>\n\n\n\n<p>For automotive and industrial boxes, you\u2019re usually fighting&nbsp;<strong>soak temperature<\/strong>, vibration, and long duty cycles. Thicker copper can add robustness, but you still need a clean stack-up and predictable process control\u2014otherwise you\u2019ll get variation between lots, and your validation data stops matching production reality.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"power-modules-and-board-as-a-heatsink-designs\">Power modules and \u201cboard-as-a-heatsink\u201d designs<\/h3>\n\n\n\n<p>For power modules, copper weight becomes part of the thermal design the way a heat spreader would. If you\u2019re using wide planes as current highways, heavier copper can reduce copper loss and improve spreading. Just don\u2019t forget: if the dielectric is the bottleneck, you should optimize that layer early, not after EVT.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"dfm-constraints-for-thick-copper-on-mcpcb\">DFM constraints for thick copper on MCPCB<\/h2>\n\n\n\n<p>Thick copper changes the manufacturing playbook:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Etch control<\/strong>\u00a0gets tougher, especially around fine features and tight clearances.<\/li>\n\n\n\n<li><strong>Solderability<\/strong>\u00a0can shift because thicker copper changes pad geometry and heat capacity during reflow.<\/li>\n\n\n\n<li><strong>Planarity<\/strong>\u00a0matters more when you mount to a heatsink; unevenness can kill your thermal interface.<\/li>\n<\/ul>\n\n\n\n<p>If you want fewer surprises, send stack-up intent and power density notes with your RFQ. If you already know the use case, our&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/services\/\">Services<\/a>&nbsp;page outlines what to include for quick quoting, and&nbsp;<a href=\"https:\/\/template01.zehannet.net\/ar\/contact-us\/\">Contact us<\/a>&nbsp;is the fastest route to align DFM rules before you lock the layout.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"quick-checklist-for-choosing-copper-weight-on-metal-core-boards\">Quick checklist for choosing copper weight on metal core boards<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Pick copper weight based on\u00a0<strong>hot spot spreading<\/strong>\u00a0and\u00a0<strong>I\u00b2R heating<\/strong>, not just \u201cthicker is cooler.\u201d<\/li>\n\n\n\n<li>If the core stays cool but the device runs hot, look hard at the\u00a0<strong>dielectric layer<\/strong>\u00a0and\u00a0<strong>interface to heatsink<\/strong>.<\/li>\n\n\n\n<li>Use heavier copper where the board carries real current and where the copper plane can act like a spreader.<\/li>\n\n\n\n<li>Flag DFM early if you need thick copper plus tight geometry.<\/li>\n<\/ul>\n\n\n\n<p>If you want, share your power level, device footprints, and target mounting method (heatsink, chassis, or free-air). I can map these rules to a clear copper-weight pick and a stack-up checklist that fits both prototyping and volume builds.<\/p>","protected":false},"excerpt":{"rendered":"<p>See how copper weight changes MCPCB heat spreading, I\u00b2R loss, and DFM limits. Learn when thicker copper helps\u2014and when dielectric rules the temps.<\/p>","protected":false},"author":1,"featured_media":1058,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_gspb_post_css":"","footnotes":""},"categories":[1],"tags":[720,713,721,708,719,712],"class_list":["post-1055","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-market-trends","tag-copper-weight","tag-ims-pcb","tag-led-pcb-design","tag-mcpcb","tag-metal-core-pcb","tag-thermal-management"],"blocksy_meta":[],"_links":{"self":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts\/1055","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/comments?post=1055"}],"version-history":[{"count":1,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts\/1055\/revisions"}],"predecessor-version":[{"id":1059,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/posts\/1055\/revisions\/1059"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/media\/1058"}],"wp:attachment":[{"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/media?parent=1055"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/categories?post=1055"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/template01.zehannet.net\/ar\/wp-json\/wp\/v2\/tags?post=1055"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}