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One-Stop PCB Factory: Prototype to Mass Production

For hardware startups and OEMs, getting high-quality PCBs quickly and reliably is critical. MC PCB is a one-stop contract PCB manufacturer supporting prototypes to volume builds—backed by experienced engineering support and rigorous QA.

MC PCB Co., Ltd.
Began in 2005
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One-Stop PCB Factory: Prototype to Mass Production

For hardware startups and OEMs, getting high-quality PCBs quickly and reliably is critical. MC PCB is a one-stop contract PCB manufacturer supporting prototypes to volume builds—backed by experienced engineering support and rigorous QA.

MC PCB Co., Ltd.
Began in 2005

Custom PCB Fabrication with Speed, Reliability & Audit‑Ready Quality

Bringing a new electronic product to market means tight timelines and exacting specifications. We deliver turnkey PCB production—from quick‑turn prototypes to scalable volumes—so startups and OEMs can focus on innovation while we manage manufacturing complexity and compliance.
engineer

1–3 Days

Typical quick‑turn prototype lead time
Up to 24 layers & advanced stackups

2–24+

Layers supported (design dependent)
HDI  RF

HDI / RF

Fine‑line, microvias, impedance control
ISO  UL

ISO / UL

Quality systems & compliance documentation

PCB Fabrication Services Overview

Turnkey PCB manufacturing from prototype to production, with one‑stop support for fabrication and assembly.

Custom PCB Prototyping & Volume Production

Quick‑turn prototypes (often 1–3 days) plus scalable production for high‑mix, low‑volume and long‑run programs.
Fast quoting for iterations and design spins
Low‑volume pilots → ramp to stable supply
Export‑ready documentation on request

Engineering Support & DFM Review

We review your stack‑up, materials, tolerances, and special notes to help prevent rework and delays.
Design for Manufacturing & Assembly feedback
Impedance checks and build recommendations
Clear communication & dedicated ownership

Advanced PCB Production Capabilities

A broad capability set for demanding applications—HDI, RF, rigid‑flex, thermal management, and more.

Rigid PCB Capability

MC PCB.,Ltd provides rigid PCB fabrication for prototypes and high-mix production: single-sided to 24-layer FR-4, RF/high-frequency and aluminum boards, plus HDI microvias and heavy copper. UL and ISO 9001/14001/13485 IATF 16949 certified. Quick quotes and fast builds with engineering support. 24/7.
Quality Assurance & Certifications
PCB Capability Table
Parameter Standard Advanced HDI
Layer Count 8 Layers (FR-4+Rogers) 12 Layers (Rogers)
Max PCB Delivery Size 300mm*450mm 400mm*500mm
Tg 280
Board Thickness 1.6mm 2.4mm
Outer Based Cu 1OZ 2OZ
Inner Based Cu 1OZ 2OZ
Aspect Ratio 12:01 15:01
Surface Treatment HASL-LF, ENIG, ENPIG, OSP, GOLD FINGER IMMERSION TIN, IMMERSION SILVER
Drill Hole Size 0.2mm 0.15
Min Line/Spacing Outer 3 mils 2 mils
Min Line/Spacing Inner 3 mils 2 mils
Min Solder Mask Bridge 5 mils 3 mils
Half Holes 20 mils 8 mils
Flex & Flex-Rigid PCB Capability (Part 1)
Item Description
Layer
  • Flexible board: 1-12Layers
  • Flex-Rigid Board: 2-32Layers
Material PI, PET, PEN, FR-4, dupont
Stiffeners FR4, Aluminum, Polyimide, Stainless Steel
Final Thickness
  • Flexible board: 0.002″ – 0.1″ (0.05-2.5mm)
  • Flexible-rigid board: 0.0024″ – 0.16″ (0.06-4.0mm)
Surface Treatment Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
Max / Min Board Size Min: 0.2″x0.3″  Max: 20.5″x13″
Min Trace Inner: 0.5oz: 4/4mil   Outer: 1/3oz-0.5oz: 4/4mil
Width / Min Clearance
  • 1oz: 5/5mil
  • 2oz: 5/7mil
Min Hole Ring
  • Inner: 0.5oz: 4mil   Outer: 1/3oz-0.5oz: 4mil
  • 1oz: 5mil
  • 2oz: 7mil
Copper Thickness 1/3oz – 2oz
Max / Min Insulation Thickness 2mil/0.5mil (50um/12.7um)

Flex PCB Capability

1–12 layer flex and 2–32 layer rigid-flex, PI/PET/PEN/FR-4 materials, 0.05–4.0mm thickness, 4/4–5/7mil rules, 8mil holes, ENIG/OSP finishes, 20.5×13in max, 50–300V test ±3mil tol.
Flex & Flex-Rigid PCB Capability (Part 2)
Item Description
Min Hole Size and Tolerance
  • Min hole: 8mil
  • Tolerance: PTH±3mil, NPTH±2mil
Min Slot 24mil x 35mil (0.6×0.9mm)
Solder Mask Alignment Tolerance ±3mil
Silkscreen Alignment Tolerance ±6mil
Silkscreen Line Width 5mil
Gold Plating Nickel: 100u” – 200u”
Immersion Nickel / Gold Nickel: 100u” – 200u”
Immersion Silver Silver: 6u” – 12u”
OSP Film: 8u” – 20u”
Test Voltage Testing Fixture: 50-300V
Profile Tolerance of Punch
  • Accurate mould: ±2mil
  • Ordinary mould: ±4mil
  • Knife mould: ±8mil
  • Hand-Cut: ±15mil

Rigid Flex Capability

Build rigid-flex PCBs from 1 to 32 layers with 12×18 in panels, 0.0071 in drills, 0.006 in finished holes, 3 oz copper, 3.5 mil trace/space, 5% impedance tolerance and filled blind/buried vias for high-density, reliable designs. Tight mask reg ±0.002 in. Plus 2 seq lams. More.
PCB Attributes (Part 1)
PCB attributes Flex Rigid-flex
Min Layer Count 1 1
Max Layer Count 12 ≤ 32
Min Core thickness .001″ (.025 mm) 3 oz (89 ml)
Max Finished Copper Weight (I/L) 2 oz (59 ml) 3 oz (89 ml)
Max Finished Copper thickness (O/L) 12 micron (.012 mm) 9 micron (.009 mm) (only for O/L)
Max Panel Size 12×18 12×18
Smallest Mechanical Drill Diameter .0079″ (.201 mm) .0071″ (.180 mm)
Smallest Laser Drill Diameter No .005″ (.127 mm)
Min Finished Hole Size .006″ (.152 mm) .006″ (.152 mm)
Max through Hole Aspect Ratio 10:01 10:01
Max Blind Via Aspect Ratio .75:1 .75:1
Min Trace and Space ≥ .0035”(.089 mm) ≥ .0035”(.089 mm)(rigid)
Min Pad Size for Test .016″ (.406 mm) .005” (.127 mm) (rigid)
PCB Attributes (Part 2)
PCB attributes Flex Rigid-flex
Process Pad Diameter D + .014″ (.356 mm) (1-mil (.025 mm) annular ring) D + .014″ (.356 mm) (1-mil (.025 mm) annular ring)
Stacked Vias No No
Min Wire Bond Pad Size > .006″ (.152 mm) > .006″ (.152 mm)
Controlled Impedance Tolerance 10% 5%
Solder Mask Registration Within .002″ (.051 mm) Within .002″ (.051 mm)
Solder Mask Feature Tolerance .001″ (.025 mm) .001″ (.025 mm)
Solder Mask Min Dam Size .004″ (.102 mm) .001″ (.025 mm)
Min Diameter Route Cutter Available .019″ (.483 mm) .024″ (.610 mm)
Mechanical Routed Part Size Tolerance .003″ (.076 mm) .010″ (.254 mm)
Bow and Twist Tolerance N/A As per spec
Thickness Tolerance +/- .002″ (.051 mm) 10%
Sequential Laminations N/A 2
Buried Vias Yes Yes
Blind Vias Yes Yes
Conductive Filled Vias No Yes
Non Conductive Filled Vias No Yes
Up to 32 layers (24 standard), FR-4 TG170 or Rogers 4350/370HR, 400×500mm max, 2oz copper, 15:1 PTH aspect, 0.15–0.2mm laser vias, 2/2mil lines, 3mil mask bridges, and HASL/ENIG/OSP/immersion finishes.
HDI Capability Table
Parameter Standard HDI Advanced HDI
Layer Count 24 Layers 32 Layers
Max PCB Size 300mm*450mm 400mm*500mm
Raw Material FR-4 TG 170 Rogers 4350, 370HR
Outer Based Cu 1OZ 2OZ
Inner Based Cu 1OZ 2OZ
Aspect Ratio (PTH) 12:01 15:01
Aspect Ratio (Laser) 1:01 0.8:1
Surface Treatment HASL, ENIG, OSP, Gold Finger, Immersion Tin, Immersion Silver HASL, ENIG, OSP, Gold Finger, Immersion Tin, Immersion Silver
Laser Hole Size 0.15mm 0.2mm
Min Line/Spacing Outer 3 mils 2 mils
Min Line/Spacing Inner 3 mils 2 mils
Solder Mask Bridge 5 mils 3 mils
Via Hole 20 mils 8 mils

HDI PCB Capability

Inspection & Testing

Metal PCB Capability

One‑Stop Turnkey
Standard and advanced HDI options up to 6 layers, sizes to 1000×500mm, 4–7kW thermal conductivity, 5–6mm thickness, 4oz outer/2oz inner copper, 12:1 aspect ratio, OSP/ENIG, and 0.8mm minimum holes.
Capability Table
Parameter Standard Advanced HDI
Layer Count 4 6
Max PCB Delivery Size 400mm*500mm 1000mm*500mm
Thermal Conductivity 4kw 7kw
Board Thickness 5mm 6mm
Outer Based Cu 3OZ 4OZ
Inner Based Cu 1OZ 2OZ
Aspect Ratio 10:01 12:01
Surface Treatment OSP/ENIG
Min Hole Sizes 1.0mm 0.8mm
Assembly Capability (Part 2)
Capability Details
Max PCB size 14.5 in. x 19.5 in.
Min PCB Thickness 0.02
Fiducial Marks Preferred but not required
PCB Finish
  • SMOBC/HASL
  • Electrolytic gold
  • Electroless gold
  • Electroless silver
  • Immersion gold
  • Immersion tin
  • OSP
PCB Shape Any
Panelized PCB
  • Tab routed
  • Breakaway tabs
  • V-Scored
  • Routed + V scored
Inspection
  • X-ray analysis
  • Microscope to 20X
Rework
  • BGA removal and replacement station
  • SMT IR rework station
  • Thru-hole rework station

SMT Capability

Double-sided SMT/PTH with BGA both sides, 0201 chips, 0.2mm micro-BGA/lead pitch (1000+ balls), 14.5×19.5in boards, wave soldering, X-ray/20× inspection, and full BGA/SMT/thru-hole rework support.
Assembly Capability (Part 1)
Capability Details
Single and double sided SMT/PTH Yes
Large parts on both sides, BGA on both sides Yes
Smallest Chips size 0201
Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000
Min Leaded parts pitch 0.008 in. (0.2 mm)
Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in.
Assembly surface mount connectors Yes
Odd form parts Yes
  • LED
  • Resistor and capacitor networks
  • Electrolytic capacitors
  • Variable resistors and capacitors (pots)
  • Sockets
Wave soldering Yes

Industry‑Focused PCB Solutions

Manufacturing approaches tailored to reliability, compliance, and lifecycle expectations across key industries.

Automotive Electronics

Traceability and reliability practices aligned to automotive supply chain expectations.

Medical Device PCBs

Controlled documentation and long lifecycle support for regulated medical products.

Industrial Automation

Robust builds for harsh environments: high‑TG laminates, stable finishes, and consistent QC.

Consumer & IoT

Compact, high‑density designs with predictable lead times for fast product cycles.

Hardware Startups & SMEs

Rapid quotes, low MOQs, and actionable DFM feedback to accelerate product validation.

OEM / ODM Programs

Stable supply, controlled change processes, and export‑ready documentation for scale.

Manufacturing Process & Workflow

From design files to finished boards—optimized for speed, transparency, and quality at every step.
1

Design Intake & Review

Upload Gerbers/BOM/stack‑up notes. We validate constraints and recommend build details. NDA available on request.
2

Rapid RFQ

Fast quote turnaround with clarifying questions surfaced early to avoid late surprises.
3

Quick‑Turn Prototypes

Prototype builds in 1–3 days for many designs, including advanced options when needed.
4

Production & Inspection

In‑line inspection (AOI / X‑ray options) and traceability controls to support consistent outcomes.
5

Global Delivery

Shipping options for North America, Europe, and APAC—including expedited logistics when required.
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Quality Assurance & Certifications

Quality systems, inspection methods, and documentation designed to meet procurement and audit expectations.

Certifications & Compliance

ISO 9001 / ISO 14001
ISO 13485 (medical) / IATF 16949 (automotive)
UL listing and RoHS/REACH considerations (as applicable)

Automated Inspection & Testing

AOI
X‑ray inspection for BGAs/leadless packages
‑ray inspection for BGAs/leadless packages
Flying probe / electrical testing

One‑Stop Turnkey

Fabrication, assembly, and parts support—coordinated by a dedicated account manager.
One‑Stop Turnkey
Traceability Packages
COA/COC, inspection reports, and controlled change processes for long‑term programs.
LDI Exposure Machine
Engineering Support
Design review to reduce redesigns: stack‑up checks, impedance notes, and manufacturability feedback.
Surface copper tester
Audit Readiness
Supplier documentation and process visibility to support internal and external audits.
legend printing
Built‑In Reliability
Process control and repeatability to keep performance consistent from prototypes to production.

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Room 1803, lA Building, Longwan, Nanhuai Road, Shajing, Bao'an District,Shenzhen City
No. 2, Lane 11, Wenming Road, Fourth Industrial Zone, Nanzha, Humen Town, Dongguan City
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